Renesas Electronics: Staff IC Package Design Engineer — Kaohsiung, Taiwan

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Staff IC Package Design Engineer in Kaohsiung, Taiwan, under reference 20035067_2026-10-20. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 22 October 2026
• Brands: Renesas Electronics

Responsibilities and work described

• 1
• Design: IC semiconductor packages, including WLCSP, BGA, FCCSP, SiP, QFN/DFN, and leaded leadframe-based packages (SOP, T/M/V/SSOP, QFP, PDIP, SOT23), to meet manufacturing and reliability requirements
• 2
• Create package layouts using Cadence APD/SiP and AutoCAD in compliance with company standards and design rules
• 3
• Collaboration: with cross-functional teams including Product Group, Package Development, Package Documentation, Package Simulation, IC Layout Design, Analog/RF/Digital Design, Assembly Engineering, Project Management and OSATs to ensure successful package execution
• 4
• Drive package design activities from concept and feasibility through production, providing technical solutions and resolving design challenges
• 5
• Optimize package designs to meet electrical, mechanical, thermal, and manufacturability requirements

Essential requirements and candidate background

• Degree (Bachelor’s, Master’s, or PhD) in Electrical, Electronics, or a related engineering discipline
• 10+ years of IC package design experience
• Expertise in WLCSP, BGA, FCCSP, SiP, QFN/DFN, and leadframe-based package technologies
• Proficiency: Cadence APD/SIP and AutoCAD
• Understanding: package design, including complex structures, and manufacturability
• Communication and teamwork skills
• Experience working with OSATs and global cross-functional teams
• Experience: Cadence Sigrity and/or Ansys tools
• Knowledge: electrical modeling and simulation
• Familiarity: SI/PI analysis and package optimization

Location, schedule and contract conditions

For this overseas or regional listing, confirm work authorisation and any location restrictions with the employer. The location does not establish visa sponsorship or permission to work remotely from India.

• Work arrangement: On-site
• Advertised location: Kaohsiung, Taiwan

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Staff IC Package Design Engineer vacancy is not an offer for reference 20035067_2026-10-20; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20035067_2026-10-20.

Compare your qualifications and experience with the essential conditions for the Kaohsiung, Taiwan position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: CAD

CAD experience should identify the discipline, deliverable and level of responsibility. Explain whether you created models or drawings, revised an established design, checked a package or coordinated with another team.

Relevant skills

• AutoCAD
• CAD
• manufacturing
• compliance
• project management
• communication