Renesas Electronics: Staff Board Package Design Engineer — Hyderabad, India

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Staff Board Package Design Engineer in Hyderabad, India, under reference 20031129_2026-07-15. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 16 July 2026
• Brands: Renesas Electronics

Responsibilities and work described

• An experienced leader for high performance SOCs/MCUs, for board and packaging group
• Essential Functions:
• Highly experienced in board and package design from block level to final board and package delivery
• Must be a natural team player and strive towards fostering a highly creative and productive working environment

Essential requirements and candidate background

• Should have the ability to work independently with little supervision and drive the team to define, develop and execute the product plan from specification to release
• MTech/BTech in EC/ EE/CS with hardware engineering experience of 7 to 10 years
• Experience: Microcontroller and Microprocessor based complex design
• Experience: latest packaging Technologies and Manufacturing process
• Domain knowledge of system clocking, system modes, power management, debug

Preferred experience and additional strengths

• Board level System architecture and design includes memory or communication interfaces
• SOC specifications and board level system specifications
• Development and design of SOC power supply, system power supply specifications, and PMIC specifications
• Interface specifications incorporating SOC-peripheral devices
• Experience: high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory
• Board level DC/AC simulations
• Schematic, Layout and BOM generation using modern CAD tools
• Experience: SoC Bring-up activities
• Familiarity: PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process
• Experience: tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D
• Experience: IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging
• Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity

Location, schedule and contract conditions

• Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day
• Work arrangement: On-site
• Advertised location: Hyderabad, India

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Staff Board Package Design Engineer vacancy is not an offer for reference 20031129_2026-07-15; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20031129_2026-07-15.

Compare your qualifications and experience with the essential conditions for the Hyderabad, India position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: Python

Python work is easier to assess through a concrete example than a list of libraries. Explain the problem, the input data, the parts you implemented and how you checked the output. Include a repository or a short technical note when you can share it.

Relevant skills

• Python
• PCB design
• CAD
• manufacturing
• communication