Renesas Electronics: Sr Staff Packaging Product Engineer — Santa Rosa City, Philippines

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Sr Staff Packaging Product Engineer in Santa Rosa City, Philippines, under reference 20034730_2026-10-21. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 22 October 2026
• Brands: Renesas Electronics

Responsibilities and work described

• Packaging design and technology development on advanced high power discrete, muti-chip, stacked and module packages
• Defining package design rules, process flow and material set for new products including automotive power packages
• Analysis: stress, thermal capability and electrical performance with in-depth knowledge of thermal-mechanical and electro-chemical interactions
• Define BOM, assembly process development, assembly specification and qualification per standard requirements
• Run process DOE’s to define optimum process windows and material characteristics on existing assembly processes and for new package development
• Resolve package reliability, assembly issues and improving existing assembly processes & materials working with OSATs across Asia to achieve target yield & quality and zero out customer returns/complaints
• Collaboration: with device design / product engineering teams and external high volume packaging vendors to achieve qualification target and ensure flawless time to market execution
• Define and drive reliability testing and qualifications plans together with reliability engineers that meet Jedec/AEC and automotive quality standards of new power packages
• Technical project management on key core technology projects includes managing timeline, material readiness, manufacturability and quality and timely reporting of progress
• Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production
• Collaboration: with assembly engineering sustaining team to resolve technical issues, improving the yield, cost, cycle time and drive continuous improvement initiatives
• Collaboration: with cross functional teams to help develop a packaging roadmap aligned with the company’s product strategy and revenue targets

Essential requirements and candidate background

• BS Degree in Electrical Engineering, Mechanical Engineering and Material Science
• Minimum experience 15 years in semiconductor packaging technology with hands-on design for manufacturability (Process Development & Package Development Engineer)
• People & leadership skills and experience in dealing with and managing OSATs
• Substantial experience in Power discrete products with multi die & stacked die configuration, Ag sintered die bonding, Al, Cu/PCC bonding, Cu clip, flip chip LGA and QFN technologies and low stress vacuum molding
• Can perform actual hands-on process capability analysis & risk prediction, design of experiments, variability charting, analysis of variance/means comparison/T-tests using SAS.JMP or mini tab software
• Experience: latest material technologies: Sapphire substrate sawing, conductive & nonconductive high thermal die attach film, Ag sintered epoxies, clip bonding, ribbon wire bonding, high CTI, high thermal, high Tg, low stress fine filler molding compounds
• Experience leading a project (program management)
• Experience: IC packaging design rules, tools (including AutoCAD)
• Familiarity of package related design/simulation software (thermos-mechanical, thermal and electrical)
• Problem-solving skills, an analytical approach to tasks and understanding of SPC techniques
• Extensive experience collaborating with OSAT vendors/suppliers, Experience in building a supply chain of vendors and service providers
• Experience: SMT or passive integrated package assembly, multichip, stacked dies packages and assembly automation
• Experience: packaging processes: Wafer Back-grinding, Wafer Dicing, flip chip bonding, die attach (Solder and epoxy), wire-bonding (Cu and Al bonding), molding, Tin plating, and package singulation
• Experience: qualification of high voltage/power packages
• Qualification in very high humidity and corrosive environment
• Knowledge: AEQ reliability requirements, APQP automotive development process and JEDEC/IPC design standards
• In English oral and written communication skills

Location, schedule and contract conditions

For this overseas or regional listing, confirm work authorisation and any location restrictions with the employer. The location does not establish visa sponsorship or permission to work remotely from India.

• Work arrangement: On-site
• Advertised location: Santa Rosa City, Philippines

Conditions requiring the complete notice

Some passages contain complex or combined conditions that have not been reduced to short eligibility statements here. Read the complete linked notice for those passages, including any alternatives, exceptions or restrictions. The concise facts above should not be treated as the full wording of every condition.

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Sr Staff Packaging Product Engineer vacancy is not an offer for reference 20034730_2026-10-21; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20034730_2026-10-21.

Compare your qualifications and experience with the essential conditions for the Santa Rosa City, Philippines position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: sales

For sales-related work, describe the customer group, product context and responsibility you held. Explain how you identified opportunities, managed an account or progressed a sale, with measurable results only where records support them.

Relevant skills

• AutoCAD
• sales
• marketing
• project management
• CAD
• electrical engineering
• mechanical engineering
• supply chain
• communication