Renesas Electronics: Senior Staff NPI Packaging Engineer — Zhubei, Taiwan

Renesas Electronics lists a Senior Staff NPI Packaging Engineer opening in Zhubei, Taiwan. The position is listed as full-time. The job description covers PCB design, manufacturing, supply chain, communication, root-cause analysis.

Recruitment overview

OrganisationRenesas Electronics
Post / roleSenior Staff NPI Packaging Engineer
Employment typeFull-time
Notification / job ID20034797_2026-10-13
Job locationZhubei, Taiwan
Work arrangementOn-site
Educational qualificationDegree / qualification: Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field
Experience requiredTypically 10+ years of experience in semiconductor packaging, with focus on WLCSP and board-level reliability
Salary / stipendSee employer notice for pay details
Last date to applySee official notice

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Senior Staff NPI Packaging Engineer in Zhubei, Taiwan, under reference 20034797_2026-10-13. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

  • Employment type: Full-time
  • Employer listing date: 22 October 2026
  • Brands: Renesas Electronics

Responsibilities and work described

  • NPI, Reliability & Technical Leadership
  • Own WLCSP package and process readiness from development through mass production
  • Define and control assembly flow, critical process parameters, materials, and reliability risks
  • Serve as final technical authority for WLCSP-related decisions impacting quality, yield, cost, and reliability
  • Board Level Reliability (BLR) & Failure Analysis Leadership
  • Own BLR test strategy definition, execution alignment, and technical interpretation
  • Leadership: failure mechanism identification, root cause analysis, and corrective action definition
  • Correlate package design, material properties, process variables, and PCB interactions to BLR performance
  • Customer Technical Interface & Program Leadership
  • Act as primary customer-facing technical lead for WLCSP NPI and reliability topics
  • Host and lead customer technical reviews, BLR updates, and issue resolution meetings
  • Quality / delivery: customer confidence through clear communication, data-driven analysis, and timely follow-up
  • Cross-Functional & Global Team Coordination
  • Coordination: global, cross-functional teams across engineering, QA, manufacturing, and supply chain
  • Drive alignment on schedule, deliverables, risk mitigation, and action closure
  • Escalate issues appropriately and facilitate resolution across organizational boundaries

Essential requirements and candidate background

  • Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field
  • Typically 10+ years of experience in semiconductor packaging, with focus on WLCSP and board-level reliability

Preferred experience and additional strengths

  • Prior experience in NPI, package engineering, or customer-facing technical roles preferred

Location, schedule and contract conditions

For this overseas or regional listing, confirm work authorisation and any location restrictions with the employer. The location does not establish visa sponsorship or permission to work remotely from India.

  • Work arrangement: On-site
  • Advertised location: Zhubei, Taiwan

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Senior Staff NPI Packaging Engineer vacancy is not an offer for reference 20034797_2026-10-13; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20034797_2026-10-13.

Compare your qualifications and experience with the essential conditions for the Zhubei, Taiwan position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: PCB design

For PCB-related work, explain the circuit or product context and the parts of schematic, layout, review or validation you handled. Discuss constraints and checks only where you were involved.

Relevant skills

  • PCB design
  • manufacturing
  • supply chain
  • communication
  • root-cause analysis
  • electrical engineering
  • mechanical engineering

Important links

Official notification / job descriptionOpen official page
Online application portalOpen official page

Read the complete official notice before applying. Availability and requirements can change.

For corrections, see our editorial policy and contact information.