Renesas Electronics: Principal Package Design Engineering — Plano, TX, United States

About Renesas Electronics

Renesas Electronics develops semiconductors for automotive, industrial, infrastructure and connected-device applications. Its employer description identifies microcontrollers, system-on-chip devices, analogue components and power products within its portfolio. These components form part of electronic systems made by other manufacturers. Renesas also describes combining complementary products into solutions for customers, connecting individual chips with the needs of an end application. Its business therefore involves both semiconductor technology and how that technology is used in wider electronic products.

The position and its setting

Renesas Electronics lists Principal Package Design Engineering in Plano, TX, United States, under reference 20035008_2026-10-16. The details below separate the work described by the employer from essential conditions, preferred experience and practical preparation advice.

• Employment type: Full-time
• Employer listing date: 21 October 2026
• Brands: Renesas Electronics

Responsibilities and work described

• Job Description
• Design: and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging
• Package technologies qualification for consumer & industrial power as well as automotive power applications
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM)
• Work: with OSAT/CM to develop, run DOE to optimize processes and establish process spec
• Work: with Product groups and Reliability team, qualify new packages and processes within required time frame
• Resolve all process integration issues by ensuring all window checks are done on critical process steps
• Establishment: production controls and monitor to ensure there is no room for quality incidents
• Quality / delivery: smooth transition into production & implement ramp up monitor
• Work: with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer
• Development: and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA
• Participate in packaging roadmap development & focus on execution
• Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses
• Establishment: & maintain package design rules

Essential requirements and candidate background

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging
• Understanding: power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software
• Knowledge: Cu FSM/BGBM technologies a plus
• Interpersonal and communication skills
• Analytical and presentation skills

Location, schedule and contract conditions

For this overseas or regional listing, confirm work authorisation and any location restrictions with the employer. The location does not establish visa sponsorship or permission to work remotely from India.

• Work arrangement: On-site
• Advertised location: Plano, TX, United States

Pay and application dates

A verified salary figure is not established in this article. An online estimate for another Principal Package Design Engineering vacancy is not an offer for reference 20035008_2026-10-16; use the employer’s own pay disclosure and recruitment communication.

A closing date is not confirmed in this article. Check the current employer page before submitting: an undated posting can change or be withdrawn.

How to apply to Renesas Electronics

Applications follow the official employer page linked below.

Open the official Renesas Electronics posting below and match the title and reference 20035008_2026-10-16.

Compare your qualifications and experience with the essential conditions for the Plano, TX, United States position, then read the preferred criteria separately.

Prepare an accurate CV and the supporting items requested in that employer’s application. Provide only information and documents you are authorised to share.

Use the employer’s application option, complete the required fields and review the submission. Retain the acknowledgement when one is provided. Job Alerts World does not receive the application.

Practical preparation: embedded systems

Embedded-system experience should identify the device or subsystem and the constraints involved. Explain the hardware and software boundary, the tools used to investigate behaviour and the part of the implementation you owned.

Relevant skills

• embedded systems
• chemistry
• marketing
• communication